Semiconductor
Hybrid-Bonded HBM: The Date SK Hynix Gave, and the One Samsung Hasn’t
SK Hynix put a name and a 2029-2030 date on hybrid-bonded HBM at Hot Chips 2026. Samsung's competing zHBM numbers still don't have one.
Facts first. Clear writing. Better decisions.
SK Hynix put a name and a 2029-2030 date on hybrid-bonded HBM at Hot Chips 2026. Samsung's competing zHBM numbers still don't have one.
When the first window is overbooked, the second one does not have to be perfect. It has to be open. The reported contact between Anthropic and Samsung carries no stated purpose, no server fit and no performance target — and…