Semiconductor
HBM4 Turns Memory Into a Co-Designed System
HBM4 shifts the bottleneck from DRAM bandwidth to logic base dies, packaging, yield and customer qualification, changing who captures value and risk.
Semiconductor
High-NA EUV Is an Economic Decision Made One Layer at a Time
High-NA EUV economics depend on each layer: avoided multipatterning, yield and cycle-time gains must exceed scanner, mask and qualification cost.
Robotics
Humanoid Robot Battery Life Is the New Deployment Wall
Thirty thousand cars. Ninety thousand parts. Sixty-five thousand hours. Those are the numbers the humanoid industry has led with over the past year, and they are real: Figure's F.02 robots helped build more than 30,000 BMW X3s and loaded more…
Semiconductor
Both Spent Heavily. Only One Kept Free Cash Flow in the Tens of Billions.
Microsoft and Meta reported on the same day with comparable AI capex ambition. The same June quarter left Microsoft free cash flow in the tens of billions and
Interests
On-Orbit Servicing Was Due in 2021. The Arms Arrive in 2027.
On-orbit servicing promised a robotic satellite repair demonstration by 2021. The arms are expected to begin servicing around 2027 - the armless version has worked since 2020.
AI
AI’s Power Demand Has a Phantom Gigawatt Problem
AI data center power demand looks enormous on paper - utilities themselves plan for far less than the announced gigawatts imply.
Robotics
FCC Covered List Adds Foreign Ground Robots Over 4.4 Pounds
The FCC Covered List now reaches foreign-made ground robots over 4.4 pounds, sweeping in vacuums and warehouse fleets while leaving fixed industrial arms out.
AI
AI Distillation: Why Anthropic’s Model Moat Is Leaking
AI distillation lets smaller models reproduce parts of a frontier model's capabilities from outputs alone. Why Anthropic's crackdown reveals a leaking moat.