Semiconductor
Samsung zHBM: Memory Bonded to the Chip, Before the Line Exists
Samsung zHBM would hybrid-bond memory directly onto AI accelerator chips, but JEDEC just widened HBM4's own spec by 55 micrometers to avoid that same bond.
Robotics
Which Robots Is America Actually Buying Right Now?
North American robot order value grew five times faster than unit count in Q2 2026 - and automotive, not humanoids, is where orders fell.
Semiconductor
HBM4 Turns Memory Into a Co-Designed System
HBM4 shifts the bottleneck from DRAM bandwidth to logic base dies, packaging, yield and customer qualification, changing who captures value and risk.
Semiconductor
High-NA EUV Is an Economic Decision Made One Layer at a Time
High-NA EUV economics depend on each layer: avoided multipatterning, yield and cycle-time gains must exceed scanner, mask and qualification cost.
Robotics
Humanoid Robot Battery Life Is the New Deployment Wall
Thirty thousand cars. Ninety thousand parts. Sixty-five thousand hours. Those are the numbers the humanoid industry has led with over the past year, and they are real: Figure's F.02 robots helped build more than 30,000 BMW X3s and loaded more…
Semiconductor
Both Spent Heavily. Only One Kept Free Cash Flow in the Tens of Billions.
Microsoft and Meta reported on the same day with comparable AI capex ambition. The same June quarter left Microsoft free cash flow in the tens of billions and
Interests
On-Orbit Servicing Was Due in 2021. The Arms Arrive in 2027.
On-orbit servicing promised a robotic satellite repair demonstration by 2021. The arms are expected to begin servicing around 2027 - the armless version has worked since 2020.
AI
AI’s Power Demand Has a Phantom Gigawatt Problem
AI data center power demand looks enormous on paper - utilities themselves plan for far less than the announced gigawatts imply.